The CSA division supplies sensors that bridge the gap between the world we live in and the digital world of machines. By converting physical signals - heartbeats, sounds, light waves - into data, we enable robots, cars and other devices to interact with people and improve our world. What drives CSA is a relentless desire to contribute to technology and have a meaningful impact on the world. This business thrives on solving complex problems and partnering with global leaders at the forefront of technological advancement. Our goal: to push the boundaries of sensor technology and empower innovators to make the world smarter, healthier and happier.
Process Analysis and Development:
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Understand the role of PECVD in depositing essential dielectric layers, such as SiO₂ and Si₃N₄ for CMOS devices.
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Investigate the impact of PECVD process parameters (e.g., precursor gas ratios, RF power, pressure, substrate temperature) on film stoichiometry.
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Identify correlations between input parameters and key output metrics like film thickness and RI.
Experimental Design and Execution:
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Develop systematic experiments using Design of Experiments (DoE) techniques.
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Perform thin film deposition runs on state-of-the-art equipment available at ams-OSRAM's fabrication facilities.
Metrology and Characterization:
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Characterize deposited thin films using ellipsometry to assess thickness and refractive index and Scanning Electron Microscopy (SEM) with Energy Dispersive X-ray Spectroscopy (EDX) to evaluate stoichiometric composition.
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Evaluate process stability, within-wafer and wafer-to-wafer uniformity.
Data Analysis and Optimization:
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Analyze experimental data using statistical tools and regression models.
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Propose optimized PECVD recipes that meet stringent CMOS specification targets.
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Derivation of Fit and Response models for process parameter tuning to optimize process capability.
Reporting and Communication:
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Document all process steps, experimental results, and analysis findings.
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Present progress in regular meetings with supervising engineers and researchers.
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Compile a final thesis report containing conclusions, visualized data, and future recommendations.
Currently enrolled in a Master’s program in Materials Science, Electrical Engineering, Physics, Nanotechnology, Chemical Engineering, or a related field.
Foundational understanding of:
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Thin film deposition processes, especially CVD.
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Semiconductor device fabrication and CMOS technology basics.
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Basic knowledge of plasma and vacuum physics
Experience with laboratory work, especially in a semiconductor or cleanroom environment, is advantageous.
Proficiency in data analysis tools such as Minitab and MATLAB is beneficial.
Strong analytical mindset, hands-on problem-solving abilities, and attention to detail.
Good communication skills in English (spoken and written), proactively and independent working style.
We offer competitive salaries and additional benefits based on your performance, experience, and qualifications. Employment is in accordance with the collective agreement for the electrical and electronics industry, employment group E (https://www.feei.at/aktuelles/mindestloehne-und-gehaelter-eei/).