Position Summary:
The Software Engineer will be responsible for developing precision motion and process control software for next-generation Thermocompression Bonders used in advanced semiconductor packaging. The role requires deep expertise in real-time control, sensor feedback loops, and multi-axis coordination to achieve sub-micron positioning, sub-Newton bonding force, and tight temperature regulation.
Key Responsibilities:
Architect and implement real-time motion control software for multi-axis (X, Y, θ, Z) precision systems.
Develop closed-loop PID and adaptive control algorithms for force, height, and thermal control subsystems.
Integrate temperature, displacement, and force feedback loops for nanometer-level repeatability.
Design software interfaces for heater ramp-up and dwell control (±5 °C accuracy).
Collaborate with mechatronics and EE teams to synchronize control timing across motion, force, and temperature domains.
Optimize bond process cycles using advanced motion trajectories and event synchronization.
Develop diagnostic and calibration routines for alignment, tilt, and Z-force verification.\
Implement data logging and predictive diagnostics for machine health and precision drift.
Required Qualifications:
Bachelor’s or Master’s in Computer Engineering, Control Systems, or Mechatronics
5+ years of experience in real-time motion or robotic control.
Expertise in C/C++, Python, and IEC 61131-3 PLC programming (TwinCAT, Codesys, or similar).
Experience with EtherCAT-based motion systems and real-time operating systems (RTOS).
Strong understanding of multi-axis kinematics and control loop tuning.
Preferred Qualifications:
Experience in semiconductor assembly equipment software.
Familiarity with dSPACE, Speedgoat, or National Instruments (NI) CompactRIO platforms.
Experience with Beckhoff TwinCAT 3, ACS Motion Control SPiiPlus, or Delta Tau PMAC control architectures.